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MSG1100D MEMS Gyros

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  1. Based on MEMS Process
  2. Angular Rate & Temp. Output
  3. 2000g Shock Resistance
  4. Integrate Signal Conditioning
  5. SPI/RS422 Interface
  6. Self-Test

MSG7100D MEMS Gyros

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  1. Based on MEMS Process
  2. Standard Ceramic Packaging
  3. Ultra-Small Size
  4. Low Power
  5. SPI Interface
  6. Self-Test
  7. Output
  8. 2000g Shock Resistance

MSG9000D MEMS Gyros

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  1. Based on MEMS Process
  2. Standard Ceramic Packaging
  3. Ultra-Small Size
  4. Low Power
  5. +5V Voltage Input
  6. SPI Interface
  7. Output
  8. Excellent Environmental Adaptability

MSG2004 Dual-axis MEMS Gyros

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  1. Based on MEMS Process
  2. Ultra-Small Size
  3. Standard Ceramic Packaging
  4. Lower Power
  5. Output
  6. 2000g Shock Resistance

MSG3000D Tri-axis MEMS Gyros

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  1. Based on MEMS Process
  2. Angular Rate, Temp. Output
  3. 2000g Shock Resistance
  4. High-density, 3 Axis Integration
  5. RS422 Interface
  6. Compact, Higher Reliability

MSI3100 MIMU

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  1. Based on MEMS Process
  2. Compensation & Calibration
  3. Completely Digital Gyros & Accelerometers
  4. Low Power, Extra-small Size
  5. High Speed Processor Embedded
  6. Robust for Vibration & Shock

MSI3200 MIMU

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  1. Based on MEMS process
  2. Compensation & Calibration
  3. Completely Digital Gyros & Accelerometers
  4. Low power, Small Size
  5. High Speed Processor Embedded
  6. High Tolerance for Vibration & Shock

MNS620 Micro Inertial/ GNSS Integrated Navigation systems

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  1. Based on MEMS Process
  2. Vibration Isolation Mechanism Embedded
  3. Fully Calibrated for the Parameters of Each Axis of Sensors
  4. 400Hz with Synchronous Sampling Rate at 230.4kSPS of Each Sensor
  5. Output Data Rate up to 400Hz, RS422 Interface
  6. Low Power, Typical 0.25A (12V)