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Microwave/RF Functional Components and Subsystems

Based on our mature RF integrated circuit design and capabilities of production line, we are able to develop and produce microwave/RF subsystems and functional components with the following features:

  1. Using thin/thick film integration technology, LTCC multilayer wiring technology and microwave multilayer circuit board automatic placement technology to achieve the miniaturization of microwave circuits;
  2. By adopting the technology of mixing application of semiconductor chips and circuit devices, the best performance can be achieved in microwave broadband and millimeter wave bands;
  3. Finally, to ensure stable supply and reliability of the components during long-term production, a large number of self-produced high-performance hybrid integrated circuits and advanced automatic placement circuit production lines are introduced.