JGW-3M (1JG0.8-1)

JGW-3M (1JG0.8-1) MIL-Spec Photo-MOS Relay

Standard

Q/RY.J01159.4—2010

 

Application

Applicable for defense, scientific research, industrial control and modern management, such as isolation drive for aerospace, aviation and ground electronic equipment, coupling amplification of digital signals, switching of analog signals, power transistor drives, measuring instruments, etc. Suitable for harsh environments.

Technical Parameters	Min.	Typ.		Max.		Unit
Input
Rated input voltage		5				Vd.c.
Rated input current		10				mAd.c.
Input switching current				5.0		mAd.c.
Input shutdown voltage	0.6					Vd.c.
Shutdown current						mAd.c.
On time				2.5		ms
Turn off time				0.5		ms
Output
Output configuration	Bidirectional		DC
Number of output circuit groups	1H (1 group normally open)
Rated output current	±0.8		1.6		Ad.c.
Rated output voltage	±50		50		Vd.c.
Output on-resistance	0.5		0.15		Ω
Output leakage current	≤1				μA
Transient voltage	90				Vd.c
Electrical Insulation Specifications
Insulation resistance	1000					MΩ
Dielectric withstand voltage				1000		Vr.m.s.
Power consumption				0.8		W
Environmental Specifications
Seal leak rate	1×10-3					Pa·cm3/s
Random vibration	40 10~2000					(m/s2)2/Hz Hz
High Frequency Vibration	294, 10~3000					m/s2, Hz
Constant acceleration	49000					m/s2
Shock	14700, 0.5					m/s2, ms
Storage temperature	-55~125					℃
Operating temperature	-55~105					℃
Other parameters
Weight				1.5		g
Dimensions	9.91×7.57×4.32					mm

 

Fig. 1: turn-on time vs. output voltage curve	Fig. 2: output current vs. ambient temperature curve	Fig. 3: Peak Inrush Current vs. Inrush Current duration curve
Fig. 4: On time vs. Input current curve	Fig. 5: Input Current vs. Input Voltage curve	Fig. 6: Output leakage current vs. ambient temperature curve

 

Outline mounting size
DIP	SMD

 

Internal circuit diagram	Overhead wiring diagram

 

Order Mark

Example: 1JG0.8-1Y

1	JG	0.8	–	1	Y
Number of output	Solid relay main name	Rated output current		Design Number	Screening Level (Y or W)

Note: The screening level (Y or W) and mounting form (DIP or SMD) should be indicated.”